Polishing Slurries
Nalco manufactures colloidal silica-based polishing slurries
that are widely used for the stock polish, edge polish and final polish steps in the
manufacture of silicon wafers and other semiconductor substrates for microchips.
These slurries are also used in the precision surface finishing of optics, watch
crystals and other glass components.
Rohm and Haas Electronic Materials CMP Technologies, a market leader in precision finishing consumables
for the global semiconductor, storage and optics industries, markets Nalco
Polishing Slurries. Nalco has partnered with Rohm and Haas Electronic Materials since 1979 in the
development and marketing of industry-standard colloidal silica polishing slurries.
This partnership leverages Rohm and Haas Electronic Materials expertise, applications capabilities and global
market and service channels with Nalco's research and manufacturing capabilities
for colloidal silica.
Customers with specialized applications or small quantity orders please contact the Nalco
Colloidal Technology Group directly at
colloidalparticles@nalco.com for assistance.
Nalco Polishing Slurries
Nalco Polishing Slurries are formulated using our own
colloidal silica sols as the abrasive with various chemical packages to meet specific
performance requirements.
NalcoŽ 2350
Nalco 2350 is specifically formulated for applications where
a balance of removal rate and exceptional surface quality is required for the stock
polish step. Nalco 2350 is one of the most widely used silicon polishing slurries in
the world.
NalcoŽ 2354
Nalco 2354 is specifically formulated for stock polishing
applications where maximum removal rate is the key parameter. Nalco 2354 also provides
excellent pad life with low glazing levels.
NalcoŽ 2360
Nalco 2360 is a colloidal silica sol with a broad particle size
distribution designed to provide superior surface quality.
NalcoŽ 2371
Nalco 2371 is specifically formulated to meet the requirements of
recirculated slurry systems.
NalcoŽ 2398
Nalco 2398 is specifically designed to lower the residual metals
levels on wafers after the stock polishing process. The level of sodium and other metal
ions in this slurry is reduced in the colloidal silica manufacturing process. In addition,
the chemical additive package specifically targets copper ions to prevent their transfer
into the bulk of the wafer. Nalco 2398 also provides high removal rates comparable to
Nalco 2354.
For additional information or assistance please contact the Colloidal
Technology Group directly at colloidalparticles@nalco.com.
